View TDA1308A_4955717.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TDA1308; TDA1308A
Class-AB stereo headphone driver
Rev. 04 -- 25 January 2007 Product data sheet
1. General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1 m Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be used at low supply voltages.
2. Features
I I I I I I Wide temperature range No switch ON/OFF clicks Excellent power supply ripple rejection Low power consumption Short-circuit resistant High performance N High signal-to-noise ratio N High slew rate N Low distortion I Large output voltage swing
3. Quick reference data
Table 1. Quick reference data VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. Symbol VDD Parameter supply voltage Conditions TDA1308 single supply dual supply TDA1308A single supply dual supply VSS IDD negative supply voltage supply current TDA1308; dual supply TDA1308A; dual supply no load 2.4 1.2 -1.5 -1.2 5.0 2.5 -2.5 -2.5 3 7.0 3.5 -3.5 -3.5 5 V V V V mA 3.0 1.5 5.0 2.5 7.0 3.5 V V Min Typ Max Unit
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Table 1. Quick reference data ...continued VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. Symbol Ptot Po (THD + N)/S Parameter total power dissipation maximum output power total harmonic distortion plus noise-to-signal ratio Conditions no load (THD + N)/S < 0.1 %
[1]
Min 100 -
Typ 15 40 0.03 -70 -92 -52 -101 110 70 105 90 -
Max 25 80 0.06 -65 -89 -40 +85
Unit mW mW % dB dB dB dB dB dB dB dB C
[1] [1]
RL = 5 k RL = 5 k RL = 5 k
[2] [3]
S/N cs PSRR Tamb
signal-to-noise ratio channel separation power supply ripple rejection ambient temperature RL = 5 k fi = 100 Hz; Vripple(p-p) = 100 mV
[1]
-40
[1] [2] [3]
VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). VDD = 2.4 V; VO(p-p) = 1.62 V (at -4.8 dBV); for TDA1308A only. VDD = 2.4 V; VO(p-p) = 1.19 V (at -7.96 dBV); for TDA1308A only.
4. Ordering information
Table 2. Ordering information Package Name TDA1308 TDA1308T TDA1308AT TDA1308AUK TDA1308TT DIP8 SO8 SO8 WLCSP8 TSSOP8 Description plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm plastic small outline package; 8 leads; body width 3.9 mm wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm plastic thin shrink small outline package; 8 leads; body width 3 mm Version SOT97-1 SOT96-1 SOT96-1 TDA1308AUK SOT505-1 Type number
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
2 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
5. Block diagram
OUTA INA(neg) INA(pos)
1 2 3
TDA1308(A)
8 VDD
7 6 5
OUTB INB(neg) INB(pos)
VSS
4
mka779
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
bump A1 index area 1 A
TDA1308AUK
2 3
B
TDA1308(A)
OUTA INA(neg) INA(pos) VSS 1 2 3 4
001aaf782
C
8 7 6 5
VDD OUTB INB(neg) INB(pos)
D
E
001aaf800
Transparent top view
Fig 2. Pin configuration TDA1308(A)
Fig 3. Pin configuration TDA1308AUK
6.2 Pin description
Table 3. Symbol OUTA INA(neg) INA(pos) VSS INB(pos) Pin description TDA1308(A) Pin 1 2 3 4 5 Description output A inverting input A non-inverting input A negative supply non-inverting input B
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
3 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Pin description TDA1308(A) ...continued Pin 6 7 8 Description inverting input B output B positive supply
Table 3. Symbol INB(neg) OUTB VDD Table 4. Symbol OUTA VSS INA(pos) OUTB INA(neg) INB(neg) VDD INB(pos)
Pin description TDA1308AUK Pin A1 A3 B2 C1 C3 D2 E1 E3 Description output A negative supply non-inverting input A output B inverting input A inverting input B positive supply non-inverting input B
7. Internal circuitry
VDD I1
INA/B(pos)
M1
M2
A1
M3
INA/B(neg) OUTA/B
Cm M4 D1 D2 D3 D4 M5 A2 M6
VSS
mka781
Fig 4. Equivalent schematic diagram
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
4 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD tSC(O) Tstg Tamb Vesd supply voltage output short-circuit duration Tamb = 25 C; Ptot = 1 W storage temperature ambient temperature electrostatic discharge voltage HBM MM
[1] [2]
Conditions
Min 0 20 -65 -40 -2 -200
Max 8.0 +150 +85 +2 +200
Unit V s C C kV V
[1] [2]
Human body model (HBM): C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative. Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 ; 3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient DIP8 SO8 TSSOP8 WLCSP8 109 210 220 1000 K/W K/W K/W K/W Conditions Typ Unit
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
5 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
10. Characteristics
Table 7. Characteristics VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. Symbol Supplies VDD supply voltage TDA1308 single supply dual supply TDA1308A single supply dual supply VSS IDD Ptot VI(os) Ibias VCM GV IO RO VO negative supply voltage supply current total power dissipation input offset voltage input bias current common mode voltage open-loop voltage gain maximum output current output resistance output voltage swing RL = 16 RL = 5 k cs PSRR CL (THD + N)/S channel separation RL = 5 k power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV load capacitance total harmonic distortion plus noise-to-signal ratio RL = 5 k RL = 5 k RL = 5 k RL = 5 k RL = 5 k S/N fG Po signal-to-noise ratio unity gain frequency maximum output power open-loop; RL = 5 k (THD + N)/S < 0.1 %
[2] [2] [3] [3] [3] [2] [2] [1]
Parameter
Conditions
Min
Typ
Max
Unit
3.0 1.5 2.4 1.2 -1.5 -1.2 0
5.0 2.5 5.0 2.5 -2.5 -2.5 3 15 10 10 70 60 0.25 70 105 90 0.03 -70 -92 -52 0.25 -101 0.0009 110 5.5 40
7.0 3.5 7.0 3.5 -3.5 -3.5 5 25 3.5 4.25 3.5 4.9 200 0.06 -65 -89 -40 1.0 80
V V V V V V mA mW mV pA pA dB mA V V V dB dB dB pF % dB dB dB % dB % dB MHz mW
TDA1308; dual supply TDA1308A; dual supply no load no load
Static characteristics
RL = 5 k (THD + N)/S < 0.1 %
[1] [1] [1]
0.75 1.5 0.1 100 -
Dynamic characteristics
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
6 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Table 7. Characteristics ...continued VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. Symbol Ci SR B
[1] [2] [3]
Parameter input capacitance slew rate bandwidth
Conditions unity gain inverting unity gain inverting
Min -
Typ 3 5 20
Max -
Unit pF V/s kHz
Values are proportional to VDD; (THD + N)/S < 0.1 %. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). VDD = 2.4 V; VO(p-p) = 1.19 V (at -7.96 dBV); for TDA1308A only.
11. Application information
VDD
C5 C2 10 F C1 100 nF R1 22 k C7 1 nF R3 3.9 k 100 F R5 10 k
5 BCK 1 8
R2
2 3 Vref 5 6
1
8
WS
2
TDA1545A
7
33 k
TDA1308(A)
C6 100 F
DATA
3 4
6
C3 1 F
7
R4 3.9 k C4 1 nF
4
C8 100 F
R6 10 k
mka783
Fig 5. Example of application with TDA1545A (stereo continuous calibration DAC)
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
7 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
12. Test information
VDD
3.9 k 100 F
VOUTA
RL
1
3.9 k
8
VINA
2 3
Vref (typ. 2.5 V)
3.9 k
TDA1308(A)
5 6 7 4
C6 100 F
VINB
3.9 k
100 F
VOUTB
RL
mka782
Fig 6. Measurement circuit for inverting application
mka784
-70 Gv (dB) -90
mka785
80 Gv (dB) RL = 32 no load
40
RL = 16 -110 32
0 -130 10-1
5 k
10-2
10-3
10-4
10-5
10-6
10-7 10-8 fi (Hz)
10-2
10-3
10-4
fi (Hz)
10-5
Fig 7. Open-loop gain as a function of input frequency
Fig 8. Crosstalk as a function of input frequency
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
8 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
100 Po (mW) 60
mka786
-50 (THD+N)/S (dB) -70
mka787
RL = 16 32
RL = 16 ; Po = 50 mW
40
8
RL = 32 ; Po = 50 mW
20
-90 RL = 5 k; VO(p-p) = 3.5 V
10
3
4
5 VDD (V)
-110 10-1
10-2
10-3
10-4
fi (Hz)
10-5
Fig 9. Output power as a function of supply voltage
Fig 10. Total harmonic distortion plus noise-to-signal ratio as a function of input frequency
-40 (THD+N)/S (dB) RL = 8 -60 16 32
mka788
-80 5 k
fi = 1 kHz -100 10-2 10-1 1 10
VO(p-p) (V)
Fig 11. Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level
12.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
9 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 12. Package outline SOT97-1 (DIP8)
TDA1308_A_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
10 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
ISSUE DATE 99-12-27 03-02-18
Fig 13. Package outline SOT96-1 (SO8)
TDA1308_A_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
11 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c y HE vMA
Z
8
5
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
4
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18
Fig 14. Package outline SOT505-1 (TSSOP8)
TDA1308_A_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
12 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
TDA1308AUK
D
B
A
bump A1 index area
A2 E A
A1
detail X
e1 1/2 e1 b v w
M M
CAB C
C y
E
1/4 e2
D
1/2 e2
C
e2
B
A
1
2
3
0
0.25 scale
0.5 mm X
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.49 A1 0.10 0.07 A2 0.39 0.37 b 0.123 0.091 D 0.65 0.57 E 0.88 0.80 e1 e2 v 0.15 w 0.05 y 0.08
0.396 0.588
OUTLINE VERSION TDA1308AUK
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 06-11-20 06-12-15
Fig 15. Package outline TDA1308AUK (WLCSP8)
TDA1308_A_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
13 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
TDA1308_A_4 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
14 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 16) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16.
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
15 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
16 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
15. Revision history
Table 10. Revision history Release date 20070125 Data sheet status Product data sheet Change notice Supersedes TDA1308_A_3 Document ID TDA1308_A_4 Modifications:
* * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors Legal texts have been adapted to the new company name where appropriate Type number TDA1308AUK has been added Product specification Product specification Product specification TDA1308_A_2 TDA1308_1 -
TDA1308_A_3 TDA1308_A_2 TDA1308_1
20020719 20020227 19940905
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
17 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
TDA1308_A_4
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 -- 25 January 2007
18 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering . . . . . . . . . . . . . . . . . 14 Wave and reflow soldering . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 January 2007 Document identifier: TDA1308_A_4

▲Up To Search▲

Price & Availability of TDA1308A

	To Download TDA1308A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .